Adopted Picosecond IR Ultra-fast Lasers are robust and affordable, it produces high energy pulses with durations below 10 ps. The laser is based on a hybrid optical amplier architecture that combines the advantages of fiber laser technology with solid state diode pumped multi-pass ampliers. Compact and water-cooled, this laser is low maintenance and never needs realignment. With burst mode optional, it could be suitable for variety applications with low cost!
1. 0.1mm-6mm reinforced and non-reinforced glass cutting, such as mobile phone glass cover, car glass cover, camera glass cover etc.
2. 0.1mm-2mm Sapphire glass cutting, such as: mobile phone sapphire cover, camera sapphire glass cover, sapphire light bar (LED light bar) etc.
3. LCD screen glass cutting, such as special-shaped LCD screen inverted R / U / C angle, LCD screen cutting.
4. Other optical lens cutting, such as filter cutting, mirror cutting etc.
Two tables fabrication saves loading and unloading time. The fabrication efficiency of the equipment can be improved effectively by the dual-manipulator asynchronous structure design.For the materials with simple cutting design, the fabrication capacity can be increased double time by the asynchronous loading and unloading structure.
The whole set of equipment achieves non-human operation through the whole process, from glass picking up in the material frame, to the laser cutting and lowering down to the material frame after being cut, which can realize the non-human operation of the whole process.
CCD intelligent camera auto positioning function, which identifies material location, identifies round shape,Cruciform shape and irregular MARK point precisely, improves fabrication accuracy.
Adjustable fixture structure design, suitable for different types and sizes of products, increasing the versatility of products.
High pressure vacuum pump adsorption device to ensure the positioning stability of the products.
Adopt linear motor, imported digital grating ruler, makes the machine with high precision. Gantry structure and marble working table, twice grinding process, high precision and stability.
| Machine model | BL6050 |
| Laser source power | 30W 50W 70W |
| Machine structure | X,Y,Z Marble Table |
| Max. stroke | 600mm*500mm*100mm |
| Re-positioning accuracy of motion platform | ±1um |
| positioning accuracy of motion platform | ±2um |
| Supported files | DXF,PLT,DWG |
| CCD Vision positioning accuracy | ±3um |
| Laser source wavelength | 1064nm |
| Beam quality | M²＜1.3 |
| Minimum focus spot | ∅3um |
| Cooling type | Constant temperature water cooling |
| Processing speed | 0-500mm/s adjustable |
PROFESSIONAL LASER
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Picosecond laser cutting machine
